Transmission electron microscopy of electrodeposits
| Autor: | Howard W. Pickering, L. A. Giannuzzi, P. R. Howell, W. R. Bitler |
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| Rok vydání: | 1993 |
| Předmět: |
Materials science
chemistry.chemical_element Condensed Matter Physics Microstructure Copper Electronic Optical and Magnetic Materials Crystallography chemistry Transmission electron microscopy Materials Chemistry Macle Electrical and Electronic Engineering Thin film Composite material Dislocation Electroplating High voltage electron microscopy |
| Zdroj: | Journal of Electronic Materials. 22:639-644 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/bf02666410 |
| Popis: | Commercial electrodeposits are usually fine grained and highly stressed. Conventional transmission electron microscopy (TEM) studies reveal defect-free structures except for the presence of twins. However, high voltage TEM studies of thick specimens show a high concentration of dislocations and lack of twins, which suggests a restructuring of electrodeposits during TEM specimen thinning. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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