Preparation of multicomponent thin films by magnetron co-sputtering method: The Cu-Ti case study
Autor: | Danuta Kaczmarek, Artur Wiatrowski, Damian Wojcieszak, Jaroslaw Domaradzki, Michal Mazur, B. Adamiak |
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Rok vydání: | 2019 |
Předmět: |
010302 applied physics
Materials science Alloy Composite number 02 engineering and technology Nanoindentation engineering.material 021001 nanoscience & nanotechnology Condensed Matter Physics 01 natural sciences Surfaces Coatings and Films Sputtering 0103 physical sciences Cavity magnetron engineering Thin film Composite material Elasticity (economics) 0210 nano-technology Instrumentation Eutectic system |
Zdroj: | Vacuum. 161:419-428 |
ISSN: | 0042-207X |
DOI: | 10.1016/j.vacuum.2019.01.012 |
Popis: | The paper discusses the preparation of multicomponent thin films of Cu-Ti composite with desired elemental composition using the pulsed magnetron co-sputtering technology. The technological goal described in the paper was deposition the Cu-Ti composite with elemental ratio of about 50/50 at%, which is close to the eutectic point from the Cu-Ti alloy system. A large difference in the sputtering yield (about seven-fold) of Cu and Ti metals was challenging, because of the features of used power supplies. Desired concentrations of the Ti and Cu elements were obtained as a result of application of multimagnetron sputtering system, where magnetrons were equipped with the Ti or Cu targets. Additionally, pulse power supply was used together with the pulse width modulation controller. Moreover, the article presents investigations of structural and mechanical properties of deposited Cu, Ti and Cu-Ti films with elemental composition of ca. 50/50 at.%. It was found that the two component Cu0.5Ti0.5 thin films were composed of Cu4Ti3 nanocrystallites built-in an amorphous matrix. As compared to the pure Cu and Ti thin films, the prepared composite exhibited improved hardness and better elasticity reflected in lower values of the Young's modulus. The results of nanoindentation investigations showed that the Cu0.5Ti0.5 composite thin film was characterized by the hardness of 7.59 GPa. |
Databáze: | OpenAIRE |
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