| Autor: |
Walter Spiess, Erik Sleeckx, Goedele Potoms, Alain Phommahaxay, Stefan Lutter, Greet Verbinnen, Kim Yess, Thomas Rapps, Alice Guerrero, Gerald Beyer, Dongshun Bai, Xiao Liu, Kim Arnold, Eric Beyne, Tim Griesbach |
| Rok vydání: |
2016 |
| Předmět: |
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| Zdroj: |
2016 IEEE 66th Electronic Components and Technology Conference (ECTC). |
| Popis: |
Over the past few years, temporary bonding has spread together with the development of 3D stacked IC (SIC) technology. Maturity of the various processes has constantly improved. Early processes enabled first demonstration of circuit thinning and thin wafer debonding. Each material generation has brought a step function in the technology maturity, which is now reaching a level allowing first 3D-SIC production. To further answer the refraining elements preventing a more massive technology adoption, novel temporary bonding materials and processes are being developed to reach even lower stress and wafer breakage risks. Hence this contribution deals with the early demonstration of a novel laser release process for ultralow-force debonding. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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