| Autor: |
David L. O'Meara, K. Tapily, Jeffrey S. Smith, Cory Wajda, Steven Consiglio, Robert D. Clark, Kai-Hung Yu, Takahiro Hakamata, Gert J. Leusink |
| Rok vydání: |
2018 |
| Předmět: |
|
| Zdroj: |
2018 IEEE 2nd Electron Devices Technology and Manufacturing Conference (EDTM). |
| DOI: |
10.1109/edtm.2018.8421524 |
| Popis: |
In this paper we present an overview and examples of thin films processing technologies for future generations of leading edge semiconductor devices. We introduce the main driving forces affecting future thin film deposition and etch technologies including the push for 3D (vertical) power, performance and area scaling. We discuss new thin films processes on the near term horizon that enable future devices, improved contacts, scaled 3D interconnects, and advanced patterning technologies followed by a future outlook for scaling. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
