High Density Microbump Development for Multi-Project Wafer (MPW) Die

Autor:	Christopher D. Nordquist, Jordan E. Gutierrez, Michael G. Wood, Andrew Ian Young, Christopher Michael, Matthew B. Jordan, Andrew E Hollowell, Jaime L. McClain
Rok vydání:	2020
Předmět:	Materials science business.industry High density Optoelectronics Wafer business Die (integrated circuit)
Zdroj:	Proposed for presentation at the InterPACK held October 27-29, 2020 in Anaheim, CA..
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2ff27a5f65142c5673efcd5ab182651b https://doi.org/10.2172/1830984 Zobrazit plný text záznamu