Building an infrastructure for parametric yield analysis: concept and implementation of a DFM platform (Invited Paper)
| Autor: | Kyung-Youl Min, John Garcia, Christophe Suzor, Victor V. Boksha, Mitch Heins, Rafik Marutyan, Anthony Adamov, John Gookassian, Sergei Bakarian, Gurgen Lachinyan, Hitendra Divecha, Bob Pack, Dean Frazier, Brian Gordon, Dan White, Brian Dillon |
|---|---|
| Rok vydání: | 2005 |
| Předmět: |
Engineering
business.industry Circuit design Critical area Hardware_PERFORMANCEANDRELIABILITY computer.software_genre Design for manufacturability Software Hardware_INTEGRATEDCIRCUITS Systems architecture Systems engineering Computer Aided Design Electronic design automation Architecture business computer |
| Zdroj: | Design and Process Integration for Microelectronic Manufacturing III. |
| ISSN: | 0277-786X |
| DOI: | 10.1117/12.600261 |
| Popis: | There is a growing realization of the need for highly integrated solutions enabled by new bi-directional data 'pipes' between design and manufacturing. Traditional EDA applications should be able to communicate and collaborate with yield analysis software. Simply adding such capabilities to existing EDA applications is not feasible. Thus, there is a need for an infrastructure that would enable such interaction in a standard way. We call this infrastructure the DFM Platform. In this article we present new approach to building such a platform. Brief descriptions of potential applications follow the platform architecture. "Via analysis" application includes test chips capabilities, critical area and critical parameter analysis to predict yield for a real design. The "DFM Cell Grading" module applies the concept of DFM to IP Libraries. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|