Influence of the Metallization Process on the Strength of Silicon Solar Cells
| Autor: | Kohn, C., Krappitz, M., Kleer, G., Reis, I., Retzlaff, M., Erath, D., Biro, D. |
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| Jazyk: | angličtina |
| Rok vydání: | 2009 |
| Předmět: | |
| ISSN: | 1419-1423 |
| DOI: | 10.4229/24theupvsec2009-2cv.2.4 |
| Popis: | 24th European Photovoltaic Solar Energy Conference, 21-25 September 2009, Hamburg, Germany; 1419-1423 The reduction of costs by decreasing the breakage rate is one major purpose of research in solar cell production technology. In order to achieve this, the level of wafer strength during manufacturing should be as high as possible. Fractures of solar cells were observed along the region where, on the rear side of the cell, the aluminum electrode print overlaps the silver-aluminum. Also, strength investigations gave indications that the strength in this special area is rather low in comparison to the situation at other areas of the solar cell. In the present work specific material and geometry related configurations of the electrodes and particularly their overlap were analyzed relating to the geometrical and material influences to the strength behavior of solar cells. A contribution to the clarification of the mechanisms leading to the observed fracture events was made. |
| Databáze: | OpenAIRE |
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