Shape Change of Cu Pillar Solder Bump During Reflow Process and Its Modeling
| Autor: | Hyo-Jong Lee, Sang-Hyuk Kim, Han-Kyun Shin, Chae-Min Park, Dong-Uk Kim, Pil-Ryung Cha, Ui-hyoung Lee |
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| Rok vydání: | 2015 |
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| Zdroj: | Korean Journal of Metals and Materials. 53:495-499 |
| ISSN: | 2288-8241 1738-8228 |
| DOI: | 10.3365/kjmm.2015.53.7.495 |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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