| Autor: |
R.F. Hobson, Glenn H. Chapman |
| Rok vydání: |
2002 |
| Předmět: |
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| Zdroj: |
1993 Proceedings Fifth Annual IEEE International Conference on Wafer Scale Integration. |
| DOI: |
10.1109/icwsi.1993.255264 |
| Popis: |
In both laser-link-oriented wafer scale integration (WSI) and multichip modules (MCMs), arrays of devices may be ordered in such a way that the actual physical position of devices is extremely important. Traditional graphic-based design systems are not well suited for such applications. Examples are presented illustrating the effectiveness of a C-based design language (CDL) for WSI laser-link bus placement and MCM chip placement and interconnection. A brief description of the CDL platform is included. > |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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