Adhesive wafer bonding of micro-actuators with SU-8 photoresist

Autor:	Wei Gao, Silviu Velicu, Deginet Admassu, Sivalingam Sivananthan, Tejumade Durowade
Rok vydání:	2020
Předmět:	Materials science Wafer bonding food and beverages Photoresist Condensed Matter Physics Electronic Optical and Magnetic Materials Hardware and Architecture Wafer Adhesive Electrical and Electronic Engineering Thin film Composite material SU-8 photoresist Layer (electronics) Hardening (computing)
Zdroj:	Microsystem Technologies. 27:3293-3297
ISSN:	1432-1858 0946-7076
DOI:	10.1007/s00542-020-05097-w
Popis:	Adhesive wafer bonding of micro-actuators using SU-8 photoresist is reported. It was investigated in this study that the bonding temperature, bonding pressure, baking time and thickness of the cross-linked SU-8 photoresist layer affects the bonding strength of the assembled micro-actuators. The adhesive wafer bonding was performed by applying different pressures while baking the wafers at different temperatures. In this work, we have demonstrated that decreasing the exposure dose and post-exposure baking temperature play significant roles in affecting the bonding strength of assembled micro-actuators. We believe that lowering the exposure dose and post-exposure temperature will inhibit hardening of the intermediate negative photo-resist layer, and it enhances softening of SU-8 thin film, which can facilitate the bonding strength between the micro-chips.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2e83c580b9364278a733a18cce85239b https://doi.org/10.1007/s00542-020-05097-w Zobrazit plný text záznamu Full text from SpringerLink