| Autor: |
Se-Ra Jeon, Chan Hwang, Jeongijn Lee, Arie Jeffrey Den Boef, Seung-Bin Yang, Woo-young Jung, Seung Yoon Lee, Farzad Farhadzadeh, Simon Gijsbert Josephus Mathijssen, Daniel Park, Jinsun Kim, Won-Jae Jang, Joon-Soo Park, Marc Noot, Kaustubh Padhye, Oh-Sung Kwon, Kaustuve Bhattacharyya |
| Rok vydání: |
2020 |
| Předmět: |
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| Zdroj: |
Metrology, Inspection, and Process Control for Microlithography XXXIV. |
| Popis: |
In multi patterning processes, overlay is now entangled with CD including OPC and stochastics. This combined effect is a serious challenge for continued shrink and is driving down the allowed overlay margin to an unprecedented level. We need to do everything to improve overlay where accurate measurement and control of wafer deformation is extremely important. This requires accuracy in overlay metrology that decouples target asymmetry from wafer deformation. Multiwavelength diffraction-based overlay (DBO) is positioned for providing such accuracy while maintaining the required measurement speed. At the same time, with the increase of process complexity in advanced nodes, several new types of target asymmetries are introduced. Some of such asymmetries vary even within the target / grating area (intra-grating) and some are so severe that it impacts the center of gravity shift of the overlay target. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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