| Autor: |
Kenneth Church, Mike Newton, Paul I. Deffenbaugh |
| Rok vydání: |
2015 |
| Předmět: |
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| Zdroj: |
International Symposium on Microelectronics. 2015:000210-000215 |
| ISSN: |
2380-4505 |
| DOI: |
10.4071/isom-2015-wa15 |
| Popis: |
3D printing structures is natural for the layer by layer approach. Using a single type of material and building complex structures is not optimized but it is mature. This digital approach to manufacturing has the advantages of lighter structures that maintain strength and can also address the emerging custom market. While these are important contributions, adding electrically functional characteristics to the structures will open new opportunities for next generation products. In the case of the presented materials, the target application is small satellite or Satlets. Adding electronics to 3D structures is not optimized or mature and therefore studying this will be important to understand the potential and the obstacles that must be addressed. Utilizing the combination of 3D printing and printed electronics, we printed a number of device demonstrations the show it is feasible to make diverse shapes with functional electronics. Demonstrations included 3D printed multilayer ceramic Ethernet harness, 3D printed plastic RF controlled impedance interconnect and USB harness and finally 3D printed connectors. Data will be presented on mechanical integrity of printed structures and electrical performance. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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