No-fault-found and intermittent failures in electronic products
| Autor: | Michael Pecht, Sanka Ganesan, Haiyu Qi |
|---|---|
| Rok vydání: | 2008 |
| Předmět: |
Electronic assemblies
Engineering business.industry Condensed Matter Physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Failure analysis Reliability engineering Forensic engineering Joint (building) Electrical and Electronic Engineering Safety Risk Reliability and Quality business human activities |
| Zdroj: | Microelectronics Reliability. 48:663-674 |
| ISSN: | 0026-2714 |
| DOI: | 10.1016/j.microrel.2008.02.003 |
| Popis: | This paper reviews the possible causes and effects for no-fault-found observations and intermittent failures in electronic products and summarizes them into cause and effect diagrams. Several types of intermittent hardware failures of electronic assemblies are investigated, and their characteristics and mechanisms are explored. One solder joint intermittent failure case study is presented. The paper then discusses when no-fault-found observations should be considered as failures. Guidelines for assessment of intermittent failures are then provided in the discussion and conclusions. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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