Electromigration in Sputter Deposited Copper/Zirconium Alloys

Autor:	N. D. McCusker, B. M. Armstrong
Rok vydání:	1999
Předmět:	Zirconium Materials science chemistry Sputtering Annealing (metallurgy) Zirconium alloy Metallurgy chemistry.chemical_element Texture (crystalline) Microstructure Copper Electromigration
Zdroj:	MRS Proceedings. 563
ISSN:	1946-4274 0272-9172
DOI:	10.1557/proc-563-115
Popis:	RF-magnetron sputter deposited copper/zirconium alloy films have been characterised in terms of resistivity, composition, microstructure, texture and stress. The properties and electromigration reliability of these alloys have been compared to those of pure sputtered copper films. The surface segregation of zirconium within the films after annealing has been studied. We have proposed a mechanism in which zirconium at the copper surface can influence the electromigration damage process, enhancing reliability.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2e57bc8528045cb1a7687ecb2d11816b https://doi.org/10.1557/proc-563-115 Zobrazit plný text záznamu Full text from SpringerLink