Post-Silicon Characterization and On-Line Prediction of Transient Thermal Field in Integrated Circuits Using Thermal System Identification
| Autor: | William J. Song, Minki Cho, Saibal Mukhopadhyay, Khondker Zakir Ahmed, Sudhakar Yalamanchili |
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| Rok vydání: | 2014 |
| Předmět: |
Materials science
Low-pass filter System identification Hardware_PERFORMANCEANDRELIABILITY Integrated circuit Industrial and Manufacturing Engineering Electronic Optical and Magnetic Materials law.invention Computer Science::Hardware Architecture CMOS Hardware_GENERAL law Frequency domain Thermal Hardware_INTEGRATEDCIRCUITS Electronic engineering Integrated circuit packaging Electrical and Electronic Engineering Thermal analysis |
| Zdroj: | IEEE Transactions on Components, Packaging and Manufacturing Technology. 4:37-45 |
| ISSN: | 2156-3985 2156-3950 |
| DOI: | 10.1109/tcpmt.2013.2271504 |
| Popis: | Thermal system identification (TSI) is presented as a methodology to characterize and estimate the transient thermal field of a packaged IC for various workloads considering chip-to-chip variations in electrical and thermal properties. The time-frequency duality is used to identify the thermal system as a low-pass filter in frequency domain through on-line power/thermal measurements on a packaged IC. The identified characteristic system for an individual IC is used for on-line prediction of the transient thermal field of that specific IC for a power pattern. A test-chip, fabricated in 130-nm CMOS, demonstrates the effectiveness of TSI in post-silicon characterization and prediction of transient thermal field. The application TSI in thermal analysis of multicore processors is presented. |
| Databáze: | OpenAIRE |
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