The Simulation Analysis of IGBT Module Based on COMSOL
| Autor: | Guoqing Qiu, Wei Wang, Shengyou Xu, Xin Yang, Kedi Jiang |
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| Rok vydání: | 2022 |
| Předmět: | |
| Zdroj: | Journal of Physics: Conference Series. 2306:012001 |
| ISSN: | 1742-6596 1742-6588 |
| Popis: | IGBT, as the core device of high-capacity power electronic equipment, its stability is directly relevant to the normal operation of the equipment. It would cause system failure and major security incidents if aging failure phenomenon occurs. A complex multi-physical field coupling process is involved in the aging failure of IGBT. Based on Comsol software, this paper conducts a series of simulations on IGBT module model SKM50GB12T4, and also improves the simulation of the solder layer voids by combining with related literature on materials science to provide a basis for subsequent research on IGBT. |
| Databáze: | OpenAIRE |
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