| Autor: |
A. Smolarek, Andrzej Moscicki, E. Merten, Tomasz Falat, Andrzej Kinart |
| Rok vydání: |
2014 |
| Předmět: |
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| Zdroj: |
2014 IEEE 16th Electronics Packaging Technology Conference (EPTC). |
| Popis: |
One of the largest problems connected with actual electronic and microelectronics systems is removing of heat generated by them, particularly through the power elements. The most so far widespread technical solutions in the range of high thermally conductive layers (Thermal Interface Materials — TIM), are compositions on the base of organic adhesives including as a fillers the particle of silver in the powder or flake shapes with the reason that it is material with very high thermal conductivity (ov. 420 W/mK). The compositions of this type are mostly thermally curing or sintering. Unfortunately this solution contain organic resins, what give the big limits the final value of the thermal conductive coefficient in the large degree, and also limits the maximum range of applying materials. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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