(Invited) Low Temperature Direct Bonding 3D Stacking Technologies for High Density Device Integration

Autor:	Thomas Signamarcheix, Thomas Lacave, Gweltaz Gaudin, Mariam Sadaka, Lea Di Cioccio, Ionut Radu, Floriane Baudin
Rok vydání:	2013
Předmět:	Materials science Stacking High density Nanotechnology Direct bonding
Zdroj:	ECS Transactions. 58:17-28
ISSN:	1938-6737 1938-5862
Popis:	3D integration aims at providing highly integrated systems by vertically stacking and connecting various materials, technologies, and functional components together. We will review the different approaches, using direct bonding, developed to address 3D devices manufacturing challenges.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2d6e19d48f98ea0ac13bddc4d4e49bd0 https://doi.org/10.1149/05809.0017ecst Zobrazit plný text záznamu