Integration of Damage-less Probe Cards Using Nano-TSV Technology for Microbumped Wafer Testing
| Autor: | Takafumi Fukushima, Shinichi Sakuyama, Masatomo Takahashi, Hiroyuki Hashimoto, Jichoel Bea, Theodorus Marcello, Hisashi Kino, Tetsu Tanaka, Mitsumasa Koyanagi, Murugesan Mariappan |
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| Rok vydání: | 2021 |
| Zdroj: | 2021 IEEE International 3D Systems Integration Conference (3DIC). |
| DOI: | 10.1109/3dic52383.2021.9687601 |
| Databáze: | OpenAIRE |
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