Polyaniline as a Curing Agent for Epoxy Resin: Cure Kinetics by Differential Scanning Calorimetry
| Autor: | Smitha M. Nair, B. Sreedhar, S. Palaniappan |
|---|---|
| Rok vydání: | 2001 |
| Předmět: |
Conductive polymer
Materials science Polymers and Plastics Organic Chemistry technology industry and agriculture Emulsion polymerization Epoxy Condensed Matter Physics Isothermal process Solvent chemistry.chemical_compound Differential scanning calorimetry chemistry visual_art Polymer chemistry Polyaniline Materials Chemistry visual_art.visual_art_medium Physical and Theoretical Chemistry Curing (chemistry) |
| Zdroj: | Macromolecular Chemistry and Physics. 202:1227-1231 |
| ISSN: | 1521-3935 1022-1352 |
| Popis: | A poly(aniline sulfate) salt was prepared by an emulsion polymerization pathway. A mixture of epoxy resin and the poly(aniline sulfate) salt sample was pre pared using chloroform as solvent, and studied using both dynamic and isothermal differential scanning calorimetry (DSC). DSC analysis was performed on samples with different polyaniline/epoxy resin ratios, in the temperature range between 40 and 350°C. A single exothermic peak was observed for the curing reaction of epoxy resin using polyaniline. The result indicates that, epoxy resin can be cured using polyaniline in a 1: 1 ratio at a temperature of 180°C for 5 min. Dynamic kinetic parameters were calculated using the Kissinger and Ozawa methods. Isothermal kinetic parameters, including k, k 2 , n and m were determined, based on an autocatalytic mechanism proposed by Kamal. |
| Databáze: | OpenAIRE |
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