THE STUDY ON THE O2 PLASMA TREATMENT FOR BONDING OF SU-8 LAYERS

Autor:	Lei Sun, Dong F. Wang, Zhifu Yin, Xue Yang, Yu Tengfei, Xinyan Jiang, Helin Zou
Rok vydání:	2019
Předmět:	Fabrication Materials science Plasma treatment Surfaces and Interfaces Condensed Matter Physics Surfaces Coatings and Films Contact angle Bonding strength Materials Chemistry Chemical stability Composite material Leakage test Thermal bonding Leakage (electronics)
Zdroj:	Surface Review and Letters. 27:1950119
ISSN:	1793-6667 0218-625X
Popis:	SU-8 is becoming increasingly important for fabrication of lab-on-a-chip devices due to its excellent chemical stability, mechanical, and optical properties. To form a complete SU-8 device, O2 plasma-assisted thermal bonding has been used to bond SU-8 layers. O2 plasma treatment is critical and has a significant influence on the fabrication quality of SU-8 devices. However, to the best of our knowledge, there is no work which analyzed O2 plasma treating process for SU-8 material in depth and systematically. In this study, the influence of O2 plasma treatment on the water contact angle and bonding strength for both un-crosslinked and crosslinked SU-8 layer was investigated in detail. The etching effect of SU-8 layer was also studied. The leakage test demonstrated that there is no gas leakage in the bonded SU-8 layer up to 0.65[Formula: see text]Mpa which indicates the practicability of the proposed SU-8 bonding method.
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2c8ca850698907a3eeebd7a26397e9dd https://doi.org/10.1142/s0218625x19501191 Zobrazit plný text záznamu