A semi-analytical boundary collocation solver for the inverse Cauchy problems in heat conduction under 3D FGMs with heat source
| Autor: | Qiang Xi, Hongli Ji, Carlos J.S. Alves, Zhuo-Jia Fu |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Physics
Numerical Analysis Collocation Mathematical analysis Inverse Cauchy distribution Boundary (topology) 02 engineering and technology Solver Condensed Matter Physics Thermal conduction 01 natural sciences Computer Science Applications 010101 applied mathematics 020303 mechanical engineering & transports 0203 mechanical engineering Mechanics of Materials Modeling and Simulation 0101 mathematics |
| Zdroj: | Numerical Heat Transfer, Part B: Fundamentals. 76:311-327 |
| ISSN: | 1521-0626 1040-7790 |
| DOI: | 10.1080/10407790.2019.1665386 |
| Popis: | In this article, the inverse Cauchy problems in heat conduction under 3D functionally graded materials (FGMs) with heat source are solved by using a semi-analytical boundary collocation solver. In ... |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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