Degradation of AlGaN/GaN HEMTs under elevated temperature lifetesting

Autor: D. Leung, P. H. Liu, D. Eng, Mike Wojtowicz, Ioulia Smorchkova, Ronald W. Grundbacher, Y.C. Chou, Aaron K. Oki, L. Callejo, Q. Kan, R. Lai
Rok vydání: 2004
Předmět:
Zdroj: Microelectronics Reliability. 44:1033-1038
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2004.03.008
Popis: Elevated temperature lifetesting was performed on 0.25 μm AlGaN/GaN HEMTs grown by MOCVD on 2-in. SiC substrates. A temperature step stress (starting at T a of 150 °C with a step of 15 °C; ending at T a of 240 °C; 48 h for each temperature cycle) was employed for the quick reliability evaluation of AlGaN/GaN HEMTs. It was found that the degradation of AlGaN/GaN HEMTs was initiated at ambient temperature of 195 °C. The degradation characteristics consist of a decrease of drain current and transconductance, and an increase of channel-on-resistance. However, there is no noticeable degradation of the gate diode (ideality factor, barrier height, and reverse gate leakage current). The FIB/STEM technique was used to examine the degraded devices. There is no detectable ohmic metal or gate metal interdiffusion into the epitaxial materials. Accordingly, the degradation mechanism of AlGaN/GaN HEMTs under elevated temperature lifetesting differs from that observed in GaAs and/or InP HEMTs. The reliability performance was also compared between two vendors of AlGaN/GaN epilayers. The results indicate that the reliability performance of AlGaN/GaN HEMTs could strongly depend on the material quality of AlGaN/GaN epitaxial layers on SiC substrates.
Databáze: OpenAIRE