Optimization study on the uniform temperature of an additively manufactured cooler for a semiconductor heating device

Autor:	Seung Yeop Lee, Kun Woo Kim, Da Hye Kim, Min Seok Yang, Ji Wook Kim, Geuna Choi, Jae Wook Lee, Il Seouk Park
Rok vydání:	2023
Předmět:	Energy Engineering and Power Technology Industrial and Manufacturing Engineering
Zdroj:	Applied Thermal Engineering. 225:120178
ISSN:	1359-4311
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2bf71641bd3decc90dc371a07542588f https://doi.org/10.1016/j.applthermaleng.2023.120178 Zobrazit plný text záznamu Full Text from ScienceDirect