Integration of step-edge grain boundary Josephson junctions with YBCO multilayers for electronics applications

Autor:	J.M. Murduck, K.P. Daly, C.L. Pettiett-Hall, M. Sergant
Rok vydání:	1995
Předmět:	Josephson effect Materials science High-temperature superconductivity Condensed matter physics Dielectric Edge (geometry) Condensed Matter Physics Electronic Optical and Magnetic Materials law.invention Pi Josephson junction law Wafer Grain boundary Electronics Electrical and Electronic Engineering
Zdroj:	IEEE Transactions on Appiled Superconductivity. 5:3131-3134
ISSN:	1051-8223
DOI:	10.1109/77.403255
Popis:	We discuss our multilayer YBCO process which uses step-edge junctions. Key issues are dielectric defect density, wiring layer critical current over edges of underlying features and junction critical current uniformity. We have demonstrated an average defect density of about 450/cm/sup 2/ over many wafers. Wiring critical current exceeds 1 mA//spl mu/m of line width. We have demonstrated SQUIDs at 77 K using this process. >
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2bf0f74b1bf0ecbb5708084f8953d317 https://doi.org/10.1109/77.403255 Zobrazit plný text záznamu