Thermal Impact of Solder Voids under Chip of Power Semiconductors

Autor:	T. Tabakoya, M. Arai, D. Inoue, K. Murakami, K. Matsuo, T. Tsujimura
Rok vydání:	2023
Zdroj:	2023 International Conference on Electronics Packaging (ICEP).
DOI:	10.23919/icep58572.2023.10129724
Databáze:	OpenAIRE
Externí odkaz:	https://explore.openaire.eu/search/publication?articleId=doi_________::2be78fd540afd44639663ff7d9d2430b https://doi.org/10.23919/icep58572.2023.10129724 Zobrazit plný text záznamu