The role of spreading resistance profiling in manufacturing control and technology development
Autor: | Jean-Michel Reynes, S. Ramey, R.J. Hillard, T. Thieme, J. Lin-Kwang |
---|---|
Rok vydání: | 2000 |
Předmět: |
Flexibility (engineering)
Engineering Spreading resistance profiling business.industry Nanotechnology Technology development Condensed Matter Physics Engineering physics Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials Electrical and Electronic Engineering Safety Risk Reliability and Quality business Device failure |
Zdroj: | Microelectronics Reliability. 40:1497-1502 |
ISSN: | 0026-2714 |
DOI: | 10.1016/s0026-2714(00)00109-8 |
Popis: | Spreading resistance profiling (SRP) has the unique ability to measure doping profiles through multiple junctions, to essentially unlimited depths and over a range of densities from 1010 to 1021 /cm3. This range and flexibility makes the technique ideally suited to find various device failure mechanisms that can arise during dopant processing, as well as aid New Technology Development (NTD). We show through case studies how SRP can reveal various failure mechanisms and illustrate its use in the development of new MOS technologies |
Databáze: | OpenAIRE |
Externí odkaz: |