| Popis: |
During RTP(Rapid Thermal Processing),temperature control precision and uniformity of wafers are the two key factors that impact the performance of wafers significantly. Based on the model obtained through the heating characteristic analysis of RTP device designed by Robot Lab of NCUT, a combined Fuzzy-PID controller is proposed. It was designed and optimized by using MATLAB Fuzzy toolbox and prepared with conventional PID strategy. The results of simulations show that the Fuzzy-PID controller solves the overshoot of temperature and has better abilities than conventional PID. In consideration of the parallel structure of Fuzzy-PID and the control of auxiliary equipments, FPGA was selected as the core processing chip to realize the design of temperature control card. Finally, based on Verilog HDL, the Fuzzy-PID controller was realized on FPGA, ensuring the precision of temperature and controlling the auxiliary equipments stably. |
