Transfer durability and fidelity of hard release-agent-free replica mold by repetition of ultraviolet nanoimprint lithography
| Autor: | Junpei Tsuchiya, Shin Hiwasa, Jun Taniguchi |
|---|---|
| Rok vydání: | 2018 |
| Předmět: |
Toughness
animal structures Materials science 02 engineering and technology medicine.disease_cause 01 natural sciences Nanoimprint lithography law.invention Contact angle Release agent law Mold 0103 physical sciences medicine Electrical and Electronic Engineering Composite material 010302 applied physics Replica technology industry and agriculture 021001 nanoscience & nanotechnology Condensed Matter Physics Durability Atomic and Molecular Physics and Optics Surfaces Coatings and Films Electronic Optical and Magnetic Materials 0210 nano-technology Ultraviolet |
| Zdroj: | Microelectronic Engineering. 193:98-104 |
| ISSN: | 0167-9317 |
| DOI: | 10.1016/j.mee.2018.02.025 |
| Popis: | Ultraviolet nanoimprint lithography provides a high-throughput and cost-effective method to fabricate nanopatterns. However, the master mold deteriorates owing to the adhesion of resin and the occurrence of defects. Prompted by the need to prevent deterioration of the master mold, we developed a new release-agent-free replica mold with high toughness and high hardness. We evaluated the durability, error rate, and fidelity of the transfer patterns of the newly developed release-agent-free replica molds of hard pillar- and hole-shaped patterns. As a result, the developed replica mold with pillar-shaped patterns exposed to UV radiation at 50 J/cm2 has the best release properties, and the replica mold with hole-shaped patterns can transfer up to 7000 imprint times under the same conditions. |
| Databáze: | OpenAIRE |
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