| Autor: |
Nicolas Delavault, Tanguy Lacondemine, Rémy Kalmar, Manuel Fendler, Sofiane Achache, Frederic Sanchette |
| Rok vydání: |
2022 |
| Zdroj: |
ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems. |
| Popis: |
The last decade has seen emerged numeric transition in industry, bringing new building blocks: Internet of Things (IoT) and additive manufacturing. A whole big new challenge was born based on sensors integration with the capability to bring intelligence into objects leveraging on additive manufacturing topological optimization, and thus operating in harsh environment thanks to efficient packaging. This work presents a new way to create 3D printed electronic patterns, based on Paste Extrusion Modeling (also called Direct Ink Writing) to extrude a superposition of insulator and conductive inorganic materials. Their raw compositions were characterized through EDS and XRD and compared to their datasheets. The obtained patterns show great electrical behavior under mechanical oscillation, opening possibilities for strain measurement. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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