Mechanical strength and interfacial failure analysis of cantilevered SU-8 microposts
| Autor: | Kuo-Kang Liu, Fan-Gang Tseng, Hwa Seng Khoo |
|---|---|
| Rok vydání: | 2003 |
| Předmět: |
Materials science
Cantilever Scanning electron microscope Mechanical Engineering Modulus Epoxy Aspect ratio (image) Electronic Optical and Magnetic Materials Mechanics of Materials visual_art visual_art.visual_art_medium Electrical and Electronic Engineering Composite material Penetration depth Displacement (fluid) Resultant force |
| Zdroj: | Journal of Micromechanics and Microengineering. 13:822-831 |
| ISSN: | 1361-6439 0960-1317 |
| DOI: | 10.1088/0960-1317/13/6/305 |
| Popis: | This paper reports the study of both the mechanical strength and interfacial failure of cantilevered SU-8 microposts fabricated on silicon substrates. An ultra-precision instrument was developed to simultaneously measure both the displacement and resultant force of specially designed SU-8 microposts under a static bending load increasing up to an interfacial fracture. Experimental results were presented for two sets of SU-8 microposts with different geometry, one with a circular cross-section and the other with a square cross-section, both having an aspect ratio larger than 1. Shear failure stresses of both circular and square microposts were estimated to be approximately 6.53 MPa ± 4.2% and 6.83 MPa ± 9.7%, respectively. The failure regions were characterized by a scanning electron microscope to determine the failure mechanism. Our experiments showed that the hardness and Young's modulus of SU-8 decreased with increasing penetration depth, and both quantities are sensitive to loading/unloading speeds. |
| Databáze: | OpenAIRE |
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