Formation of Thick High-Aspect-Ratio Resistive Masks by the Contact Photolithography Method
| Autor: | V. I. Kondrat’ev, A. N. Gentselev, A. G. Lemzyakov, F. N. Dultsev |
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| Rok vydání: | 2018 |
| Předmět: |
Resistive touchscreen
Fabrication Materials science business.industry 02 engineering and technology 021001 nanoscience & nanotechnology Condensed Matter Physics Laser 01 natural sciences law.invention 010309 optics Etching (microfabrication) law 0103 physical sciences Optoelectronics Electrical and Electronic Engineering Photonics Photolithography 0210 nano-technology business LIGA Instrumentation Diode |
| Zdroj: | Optoelectronics, Instrumentation and Data Processing. 54:127-134 |
| ISSN: | 1934-7944 8756-6990 |
| Popis: | A method of fabrication of thick (~100 μm and more) resistive masks is described. These masks can be used for solving various engineering problems, e.g., for fabricating x-ray-absorbing topological patterns for LIGA masks, stamp microrelief, cast moulds, etc. Specific features of the contact photolithography method, which is used to design and fabricate the research device, are described. A source of exposure radiation in this device is a light-emitting diode. A possibility of obtaining individual elements of the resistive mask (in particular, with the lateral size ~5 μm, height of ~70 μm, and aspect ratio of ~14) and also the titanium stamp microrelief (with the height up to ~40 μm) generated by means of reactive ion-beam etching through the resistive mask, is experimentally demonstrated. |
| Databáze: | OpenAIRE |
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