InFO_AiP Technology for High Performance and Compact 5G Millimeter Wave System Integration
| Autor: | H. P. Pu, Chun-Wen Lin, Chung-Hao Tsai, Chuei-Tang Wang, Che-Wei Hsu, Jeng-Shien Hsieh, Tzu-Chun Tang, Douglas Yu, Wu Kai-Chiang |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Patch antenna Materials science business.industry Transmission loss Bandwidth (signal processing) 020206 networking & telecommunications 02 engineering and technology 01 natural sciences 0103 physical sciences Extremely high frequency 0202 electrical engineering electronic engineering information engineering Optoelectronics Redistribution layer Radio frequency Antenna gain Wideband business |
| Zdroj: | 2018 IEEE 68th Electronic Components and Technology Conference (ECTC). |
| DOI: | 10.1109/ectc.2018.00039 |
| Popis: | InFO_AiP technology, with low loss chip-to-antenna interconnect and wideband slot-coupled patch antenna, is proposed for low power, high performance, and compact 5G millimeter wave (mmWave) system integration. The low loss chip-to-antenna interconnect is related to low metal surface roughness of redistribution layer (RDL) and smooth interconnect transition between chip and package in InFO technology. The InFO RDL with low metal roughness results in transmission loss of 0.3 dB/mm which is lower than the loss of Cu trace on substrate, and the smooth interconnect transition with low discontinuity structure reduces the interconnect loss, by 0.78 dB at 60 GHz. A wideband slot-coupled patch antenna is designed successfully with 22.8% FBW (56.6-71.2GHz) and over antenna gain of 3 dBi in the operating band. To verify the technology performance, an InFO_AiP sample at 60 GHz is first designed, fabricated, and measured. The measurement result has a good agreement with the simulation and shows S11 ? -10 dB bandwidth of 55-65 GHz. As a result, InFO_AiP is a leading technology for 5G mmWave system application from power and performance considerations. |
| Databáze: | OpenAIRE |
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