Autor: |
J.F. Lane, G.B. Freeman, L.J. Turbini, R.D. Boswell, J.D. Finney, M.H. Smith |
Rok vydání: |
1991 |
Předmět: |
|
Zdroj: |
Soldering & Surface Mount Technology. 3:24-31 |
ISSN: |
0954-0911 |
DOI: |
10.1108/eb037752 |
Popis: |
A new corrosion test for assessing flux residues is applied to marginally cleaned water soluble fluxed test boards and low solids/no clean fluxed test boards. This test method developed by Bono has been modified to accelerate the corrosion process. The corrosion mechanism observed in this study is conductive anodic filament (CAF), a corrosion mechanism proposed in 1979 by Lando et al. It is postulated that this degradation mechanism is due to the high bias voltage (190 V) coupled with the high humidity (85%) and high temperature (85°C) conditions used in this test. Important parameters in the test method are discussed and recommended refinements are given. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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