3D Packaging Materials Based on Graphite Nanoplatelet and Aluminum Nitride Nanocomposites

Autor: Kenneth E. Goodson, Srilakshmi Lingamneni, Amy Marconnet
Rok vydání: 2013
Předmět:
Zdroj: Volume 10: Micro- and Nano-Systems Engineering and Packaging.
DOI: 10.1115/imece2013-66419
Popis: Nanostructured composites with efficient percolation networks are promising candidates for packaging materials due to their high thermal conductivity. In this study, we investigate the thermal conductivity of composites consisting of a combination of exfoliated graphene nanoplatelet (xGNP) and aluminum nitride (AlN) particles in polyvinylidine fluoride (PVDF) matrix. The surfaces of the AlN particles are treated with silane to reduce the interfacial thermal resistance at particle-matrix boundary. Samples with 50 vol% AlN and 2 vol% xGNP showed an order of magnitude enhancement in thermal conductivity. AlN composites (with and with out xGNP) showed evidence of effective percolation pathways for AlN vol % over ∼40.Copyright © 2013 by ASME
Databáze: OpenAIRE