| Autor: |
Simon Lim Siak Boon, Tai Chong Chai, Sharon Lim Pei Siang, Ser Choong Chong, Eva Wai Leong Ching |
| Rok vydání: |
2020 |
| Předmět: |
|
| Zdroj: |
2020 IEEE 70th Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc32862.2020.00143 |
| Popis: |
Mobile application or appliance demands multi-functions, high speed, light or small form factor and low cost. One of the common approaches to meet all these requirement is put one package over another package. This approach is commonly known as Package on Package. Package on Package can be realized by assembled the package either through the use of organic substrate, or fan-out wafer level package. The top package is stacked on top of the bottom package using solder balls or copper pillars.In this paper, we used fan-out wafer level package’s approach to demonstrate the vertically integrated package on package. The top and bottom package are merged together using fan-out wafer level approach during the assembly process to form Vertically Integrated Package on Package. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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