Additive process for patterned metallized conductive tracks on cotton with applications in smart textiles
| Autor: | John E. Graves, Christopher Hunt, K. A. Wills, K. Krzyzak, Andrew J. Cobley, R. Ashayer-Soltani, J. Bush |
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| Rok vydání: | 2017 |
| Předmět: |
Materials science
Polymers and Plastics Materials Science (miscellaneous) chemistry.chemical_element Nanotechnology 02 engineering and technology Substrate (printing) 010402 general chemistry 021001 nanoscience & nanotechnology 01 natural sciences Copper Industrial and Manufacturing Engineering 0104 chemical sciences Contact angle Dwell time chemistry Plating Copper plating Composite material 0210 nano-technology General Agricultural and Biological Sciences Electrical conductor Sheet resistance |
| Zdroj: | The Journal of The Textile Institute. 109:268-277 |
| ISSN: | 1754-2340 0040-5000 |
| DOI: | 10.1080/00405000.2017.1340822 |
| Popis: | The selective patterning of silver nanoparticles by a patent pending process to act as a catalyst for metallization with electroless copper was explored on cotton, with a view towards application in the wearable technology sector. Whole area coverage or tracks serving as point-to-point connections were achieved by depositing the catalyst via spraying, or in more controlled manner using a microdispenser, respectively. Optimization of the catalyst deposition is described, including substrate characterization via contact angle, FTIR and surface charge measurement. The effects of the copper plating bath temperature and dwell time in the plating bath are examined. With plating times as short as 10 min, samples of good conductivity (sheet resistance, R = |
| Databáze: | OpenAIRE |
| Externí odkaz: |
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