Material properties of anisotropic conductive films (ACFs) and their flip chip assembly reliability in NAND flash memory applications
| Autor: | Chang-Kyu Chung, Kyung-Woon Jang, Woong-Sun Lee, Kyung-Wook Paik |
|---|---|
| Rok vydání: | 2008 |
| Předmět: |
Hardware_MEMORYSTRUCTURES
Materials science Modulus Hardware_PERFORMANCEANDRELIABILITY Data_CODINGANDINFORMATIONTHEORY Temperature cycling Condensed Matter Physics Chip Atomic and Molecular Physics and Optics Thermal expansion Surfaces Coatings and Films Electronic Optical and Magnetic Materials Hardware_INTEGRATEDCIRCUITS Electronic engineering Electrical and Electronic Engineering Composite material Safety Risk Reliability and Quality Material properties Glass transition Electrical conductor Flip chip |
| Zdroj: | Microelectronics Reliability. 48:1052-1061 |
| ISSN: | 0026-2714 |
| Popis: | In this paper, the material properties of anisotropic conductive films (ACFs) and ACF flip chip assembly reliability for a NAND flash memory application were investigated. Measurements were taken on the curing behaviors, the coefficient of thermal expansion (CTE), the modulus, the glass transition temperature (Tg), and the die adhesion strength of six types of ACF. Furthermore, the bonding processes of the ACFs were optimized. After the ACF flip chip assemblies were fabricated with optimized bonding processes, reliability tests were then carried out. In the pressure cooker test, the ACF with the highest adhesion strength showed the best reliability and the ACF flip chip assembly revealed no delamination at the chip-ACF interface, even after 96 h. In the high temperature storage test and the thermal cycling test, the reliability of the ACF flip chip assembly strongly depends on the Tg value of the ACF. In the thermal cycling test, in particular, which gives ACF flip chip assemblies repetitive shear stress, high value of CTE above Tg accelerates the failure rate of the ACF flip chip assembly. From the reliability test results, ACFs with a high Tg and a low CTE are preferable for enhancing the thermal and thermo-mechanical reliability. In addition, a new double-sided chip package with a thickness of 570 μm was demonstrated for NAND flash memory application. In conclusion, this study verifies the ACF feasibility, and recommends the optimum ACF material properties, for NAND flash memory application. |
| Databáze: | OpenAIRE |
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