Bias influence on titanium interlayer for titanium nitride films
| Autor: | G. C. Lain, Carlos A. Figueroa, F. Cemin, S. S. Tomiello, C. M. Menezes, Cesar Aguzzoli, Israel Jacob Rabin Baumvol |
|---|---|
| Rok vydání: | 2016 |
| Předmět: |
Materials science
chemistry.chemical_element 02 engineering and technology Substrate (electronics) 01 natural sciences chemistry.chemical_compound 0103 physical sciences Materials Chemistry Deposition (phase transition) computer.programming_language 010302 applied physics Metallurgy Surfaces and Interfaces Nanoindentation equipment and supplies 021001 nanoscience & nanotechnology Condensed Matter Physics Evaporation (deposition) Titanium nitride eye diseases Surfaces Coatings and Films chemistry Scratch sense organs 0210 nano-technology Tin computer Titanium |
| Zdroj: | Surface Engineering. 32:279-283 |
| ISSN: | 1743-2944 0267-0844 |
| DOI: | 10.1179/1743294415y.0000000097 |
| Popis: | This work investigates the deposition of TiN thin films by cathodic arc evaporation on stainless steel AISI 304 substrate for decorative applications. The applied voltage bias on the substrate during the Ti interlayer deposition was varied, and several properties were determined. The chemical profile, crystalline structure and microstructural properties were analysed by glow discharge optical emission spectroscopy, glancing angle X-ray diffraction and SEM techniques respectively. In addition, nanoindentation and sliding tests were performed in order to evaluate the hardness and scratch resistance of TiN thin films. The results showed that the applied voltage bias during the Ti interlayer deposition step could modify some properties of the TiN thin films. Indeed, lower oxygen contents and higher critical loads to start a plastic deformation (scratch resistance) of the TiN thin films are achieved at higher applied voltage biases during the Ti interlayer deposition. A higher scratch resistance is capable of ... |
| Databáze: | OpenAIRE |
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