| Autor: |
Michael A. Gaynes, Pritish R. Parida, Gerard McVicker, Timothy J. Chainer, Evan G. Colgan, Thomas Brunschwiler, Bing Dang, Mark D. Schultz, Fanghao Yang, John U. Knickerbocker, Arvind Sridhar |
| Rok vydání: |
2017 |
| Předmět: |
|
| Zdroj: |
2017 33rd Thermal Measurement, Modeling & Management Symposium (SEMI-THERM). |
| DOI: |
10.1109/semi-therm.2017.7896920 |
| Popis: |
Interlayer cooling utilizing pumped two-phase flow of a chip-to-chip interconnect-compatible dielectric fluid is an enabling technology for future high power 3D (three-dimensional) chip stacks. Development of this approach requires high fidelity and computationally manageable conjugate thermal models. In this paper, a conjugate heat transfer model developed for simulating two-phase flow boiling through chip embedded micron-scale channels is described. This model uses a novel hybrid approach where governing equations for flow-field and convection in the single-phase flow regions (e.g. inlet plenum) as well as that for heat conduction in solids is solved in detail (i.e., full-physics) while in the two-phase flow regions (e.g. micro-channels), a reduced-physics approach is used. Extensive model validation using data from several experiments was performed to quantify the accuracy of this model under different operating conditions. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
|
