Investigation of the thermal properties of a laser-diode linear array on a silicon carbide heat sink
Autor: | S I Derzhavin, A A Kazakov, Yu P Koval, A M Prokhorov, V N Timoshkin, Gennadi I Babayants, B Sh Kishmakhov, D A Mashkovskii, V V Kuz'minov, Victor V. Apollonov, M N Gruden, V P Smekalin |
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Rok vydání: | 1997 |
Předmět: |
Materials science
Laser diode business.industry Thermal resistance Statistical and Nonlinear Physics Heat sink Laser Atomic and Molecular Physics and Optics Electronic Optical and Magnetic Materials law.invention chemistry.chemical_compound chemistry law Soldering Thermal Silicon carbide Optoelectronics Electrical and Electronic Engineering business Diode |
Zdroj: | Quantum Electronics. 27:845-849 |
ISSN: | 1468-4799 1063-7818 |
Popis: | An investigation was made of the operating characteristics of a linear array of AlGaAs laser diodes indium-soldered to an SiC heat sink. The average output power was 14 W and the efficiency was ~ 25%. The thermal impedance of the system was 0.05K W-1. A comparison of the experimental results with heat flow fluctuations showed that, in spite of a thick solder layer, the system was capable of draining heat at an average rate twice that detected experimentally. The discrepancy between the experimental and theoretical results could be explained by structural imperfections of the solder layer, typical of the adopted method for bonding a linear diode array to a heat sink and to electrodes. |
Databáze: | OpenAIRE |
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