| Autor: |
Melanie Bawohl, Sarah Groman, Christina Modes, Jochen Langer, Virginia C. Garcia, Mark Challingsworth, Jessica Reitz, Anja Eisert |
| Rok vydání: |
2013 |
| Předmět: |
|
| Zdroj: |
Additional Conferences (Device Packaging, HiTEC, HiTEN, and CICMT). 2013:000155-000161 |
| ISSN: |
2380-4491 |
| DOI: |
10.4071/cicmt-wp24 |
| Popis: |
Electronic circuits made by thick film technology are commonly used today in electronic circuitry for automotive applications. Densely packed multi-layer hybrid circuits are very well established for motor and transmission management in standard gasoline fuelled vehicles. As automotive technology shifts from mechanical systems to electrical systems and toward more electrically driven vehicles, such as hybrid electric vehicles and full electric vehicles, thick film systems need to be adapted to fit the challenges and needs of these new applications. The following is a description of a new set of thick film pastes, both precious and base metal, which have attributes and performance suitable for power electronics in automotive applications. The materials provide a means to use common thick film technology to build power circuits to meet the new needs, such as high current carrying capacity and thermal dissipation. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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