Autor: |
Ho-Suk Kim, In-Sang Song, Yong-Soo Oh, Seong-O Choi, S.J. Kang, B.J. Ha, Hoon Song, Cimoo Song, Seong-Soon Baek |
Rok vydání: |
2002 |
Předmět: |
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Zdroj: |
Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308). |
DOI: |
10.1109/memsys.2000.838571 |
Popis: |
A highly reliable, wafer level vacuum packaged and de-coupled vertical microgyroscope was developed. The de-coupled gyroscope which had four driving springs and two sensing springs was designed and fabricated. A new fabrication process which could realize a high aspect ratio and use a thick single crystalline silicon as a structure layer, was proposed. The vacuum environment for operating a vibratory gyroscope was accomplished with vacuum packaging at wafer level. The vacuum level of ambient pressure was about 150 mtorr. The resolution of the gyroscope was 0.013/spl deg//sec/Hz/sup 1/2/. The output nonlinearity was below 2% in /spl plusmn/100/spl deg//s full scale. |
Databáze: |
OpenAIRE |
Externí odkaz: |
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