Wafer level vacuum packaged de-coupled vertical gyroscope by a new fabrication process

Autor: Ho-Suk Kim, In-Sang Song, Yong-Soo Oh, Seong-O Choi, S.J. Kang, B.J. Ha, Hoon Song, Cimoo Song, Seong-Soon Baek
Rok vydání: 2002
Předmět:
Zdroj: Proceedings IEEE Thirteenth Annual International Conference on Micro Electro Mechanical Systems (Cat. No.00CH36308).
DOI: 10.1109/memsys.2000.838571
Popis: A highly reliable, wafer level vacuum packaged and de-coupled vertical microgyroscope was developed. The de-coupled gyroscope which had four driving springs and two sensing springs was designed and fabricated. A new fabrication process which could realize a high aspect ratio and use a thick single crystalline silicon as a structure layer, was proposed. The vacuum environment for operating a vibratory gyroscope was accomplished with vacuum packaging at wafer level. The vacuum level of ambient pressure was about 150 mtorr. The resolution of the gyroscope was 0.013/spl deg//sec/Hz/sup 1/2/. The output nonlinearity was below 2% in /spl plusmn/100/spl deg//s full scale.
Databáze: OpenAIRE