An investigation of an industrial coating environment with planar probe technology
| Autor: | K.E. Cooke, J. Hampshire, D.G. Teer, A. Goodyear |
|---|---|
| Rok vydání: | 2004 |
| Předmět: |
Materials science
Argon business.industry Ion plating Analytical chemistry Pulsed DC chemistry.chemical_element Biasing Surfaces and Interfaces General Chemistry Plasma engineering.material Condensed Matter Physics Surfaces Coatings and Films Coating chemistry Physics::Plasma Physics Sputtering Materials Chemistry engineering Optoelectronics Radio frequency business |
| Zdroj: | Surface and Coatings Technology. :750-755 |
| ISSN: | 0257-8972 |
| DOI: | 10.1016/j.surfcoat.2004.07.049 |
| Popis: | A novel electrostatic probe method has been applied to the plasma characterization of an industrial magnetron-based ion plating plasma system. The probe consists of a small, 7-mm diameter, disk fitted with a guard ring and mounted near the substrate position. A negative DC self-bias is achieved on the probe surface relative to the plasma by application of a radio frequency (RF) burst across an in-line capacitor. Following the termination of the RF burst a current–voltage characteristic is obtained as the probe potential returns to a floating condition through the arrival of positive ions from the plasma. Use of capacitively coupled RF biasing permits operation of the probe in a deposition environment. The guard ring maintains sheath planarity at the probe surface and eliminates edge effects. Total positive ion flux and the energetic tail of the electron distribution function are determined from the probe's current–voltage characteristic. Results are reported for ion flux and electron energy distribution measurements in DC and pulsed DC plasmas in closed field unbalanced magnetron sputter ion plating (CFUBMSIP) industrial coating equipment. Argon and combined argon and reactive gas atmospheres at below 0.5 Pa were used. Measurements are correlated with the deposition system's configuration and deposition parameters, including magnetron and substrate voltages, bias currents, and pulsing conditions. Potential applications and limitations of the planar probe technique for routine process control in an industrial coating environment are discussed. |
| Databáze: | OpenAIRE |
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