Room Temperature Bonding on Interface Between Metal and Ceramic
| Autor: | Young-Sik Song, Sung-Chul Lim, Soo-Keun Park, Sungwook Mhin, Kyu-Bong Jang, Keun-Hyo Lee, Seung Hwan Lee, Soong-Keun Hyun, Kyoung-Il Moon |
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| Rok vydání: | 2018 |
| Předmět: |
010302 applied physics
Interconnection Materials science 02 engineering and technology Adhesion 021001 nanoscience & nanotechnology Condensed Matter Physics Thermal conduction 01 natural sciences Electronic Optical and Magnetic Materials Metal Surface activated bonding visual_art 0103 physical sciences Heat spreader Materials Chemistry visual_art.visual_art_medium Ceramic Electrical and Electronic Engineering Composite material 0210 nano-technology Contact area |
| Zdroj: | Journal of Electronic Materials. 48:72-78 |
| ISSN: | 1543-186X 0361-5235 |
| DOI: | 10.1007/s11664-018-6693-8 |
| Popis: | The influence of surface activated bonding (SAB) on adhesion strength between a metal and ceramic including Al/AlN and Cu/AlN is investigated. Plasma pre-treatments can significantly increase the adhesion strength between the metal and ceramic through surface activation, which can enlarge the contact area between metal and ceramic. Bonding pressure is also an important factor to improve the adhesion between metal and ceramic during SAB. Successful bonding between the metal and ceramic via SAB can be attributed to the formation of the interface layer where plastic deformation and rearrangement of metal to the ceramic occurs, which improves the atomic scale interconnection between the metal and ceramic. In this study, the influence of experimental SAB conditions for processing such as plasma power, degree of vacuum and bonding pressure on adhesion strength is investigated. Also, the thermal conduction of metal/ceramic laminates is discussed for its potential application as a heat spreader of LED chips. |
| Databáze: | OpenAIRE |
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