| Popis: |
A baseline model providing technical performance specifications and preliminary cost assessments for a prototype Soft X-ray Projection Lithography (SXPL) system is presented. We find that the technical performance requirements for components of the SXPL system are beyond the current state of the technology. We have also conducted a wafer cost analysis for the proposed SXPL system. In our parametric analysis of normalized wafer exposure costs we find that variations in direct cost items (e.g., resist, mask optics, laser) have a small effect on wafer costs. More important are variations in variations in the performance of technical parameters which affect wafer throughput. Of these, mirror reflectivity is by far the most important, followed by optical design (which can reduce the number of mirrors), then parameters related to x-ray generation and collection, and finally resist sensitivity. The lifetime of multilayer coatings is not by itself a critical parameter in determining wafer exposure costs. However, the repairability of such coatings can be important. Indeed, if mirror replacement is required when coatings degrade (i.e., nonrepairable), then mirror lifetime becomes about as important as resist sensitivity in determining wafer exposure costs. |
