Chemistry, Microstructure, and Adhesion of Metal—Polymer Interfaces
| Autor: | Richard Haight, Franz Faupel, B. D. Silverman, Robert C. White, Paul S. Ho |
|---|---|
| Rok vydání: | 1991 |
| Předmět: |
chemistry.chemical_classification
business.industry Interface (computing) Nanotechnology Hardware_PERFORMANCEANDRELIABILITY Adhesion Polymer Microstructure Chip Metal chemistry visual_art Hardware_INTEGRATEDCIRCUITS visual_art.visual_art_medium Microelectronics Condensed Matter::Strongly Correlated Electrons business Hardware_LOGICDESIGN |
| Zdroj: | Fundamentals of Adhesion ISBN: 9781489920751 |
| DOI: | 10.1007/978-1-4899-2073-7_14 |
| Popis: | In microelectronics, the large-scale integration of devices necessitates the use of multi-layered metallization structures on the chip level and for packaging. Such structures are usually fabricated using alternate metal and insulating layers. This incorporates metal—insulator interfaces throughout the structure which, depending on the configuration and dimension of the devices, can have varying degree of complexities. These interfaces have to be designed with certain functional characteristics, particularly good chemical and adhesion properties. For this purpose, it is important to understand these basic properties of the metal—insulator interface. |
| Databáze: | OpenAIRE |
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