| Autor: |
Michael Liu, Jenn An Wang, JaeMyong Kim, Jae-Pil Kim, Anthony D. Yang, OhYoung Kwon, YongHyuk Jeong, Eric Yang, Eric Ouyang, Susan Lin |
| Rok vydání: |
2021 |
| Předmět: |
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| Zdroj: |
2021 IEEE 71st Electronic Components and Technology Conference (ECTC). |
| DOI: |
10.1109/ectc32696.2021.00335 |
| Popis: |
System-in-Package (SiP) technology has been used for a wide range of electronic devices, but the warpage behavior of the package can be difficult to control and predict due to complex manufacturing parameters and processes [1], [2]. Previous research on the warpage primarily focused only on the SiP module unit, while the consideration of strip warpage as a function of manufacturing processes has not typically been studied theoretically and experimentally. In this paper, the impact of manufacturing processes, mainly the compression molding process, on the warpage is investigated experimentally and numerically. To better understand the advantages of compression molding, we will also compare compression molding with transfer molding using a computer simulation. The paper will point out the pros and cons of these two different manufacturing processes. |
| Databáze: |
OpenAIRE |
| Externí odkaz: |
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