Studying the Impact of Return Current Path on the EM Simulation of High-Speed Package and Board Designs
| Autor: | Antonio Ciccomancini Scogna, Darryl Kostka |
|---|---|
| Rok vydání: | 2012 |
| Předmět: |
Engineering
Computer Networks and Communications Plane (geometry) business.industry Electronic Optical and Magnetic Materials Return current Path (graph theory) Electronic engineering Boundary value problem Signal integrity Electrical and Electronic Engineering Differential (infinitesimal) Spurious relationship business computer Simula computer.programming_language |
| Zdroj: | Journal of Microelectronics and Electronic Packaging. 9:52-64 |
| ISSN: | 1551-4897 |
| DOI: | 10.4071/imaps.318 |
| Popis: | Three-dimensional electromagnetic simulation models are often simplified in order to reduce simulation time and memory requirements without sacrificing the accuracy of the results. A commonly adopted methodology in the simulation of complex electronic package and board designs is to truncate the size of the model, leaving only a few important features surrounding the nets of interest. In this paper we demonstrate that this simplification can have a significant impact on the simulation results if it is not performed carefully, and it can introduce spurious nonphysical resonances. The interaction between cavities and signals is first studied using a simple coupled differential via test structure. It is demonstrated that the return currents generated by these vias excite cavity resonances in power-ground plane pairs causing them to behave as parallel-plate waveguides. The role of interplane shorting vias in suppressing cavity resonances is then investigated and the impact of boundary conditions on the simulation results of package models is also shown and discussed. The focus is then shifted to PCB/package cosimulation and the impact of different truncation schemes is discussed through the simulation of test structures of varying complexity. A simulation methodology is then proposed and is verified for a combined model of a realistic complex multilayer package and board and it is demonstrated that accurate results can be obtained through proper truncation of the geometry. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|