Study on the Die-Attach Voids Distribution With X-Ray and Image Processing Techniques
| Autor: | Aleksander Sešek, Olga Chambers, Janez Trontelj |
|---|---|
| Rok vydání: | 2019 |
| Předmět: |
Materials science
business.industry X-ray Image processing 02 engineering and technology Image segmentation 021001 nanoscience & nanotechnology 01 natural sciences Edge detection Die (integrated circuit) Computer Science Applications Electronic Optical and Magnetic Materials Optics Mechanics of Materials Soldering 0103 physical sciences Statistical analysis Electrical and Electronic Engineering 010306 general physics 0210 nano-technology business |
| Zdroj: | Journal of Electronic Packaging. 141 |
| ISSN: | 1528-9044 1043-7398 |
| Popis: | Power electronic components' reliability depends, to a great extent, on the quality of die-attach technology. The voids appearance in the die-attach regions is almost unavoidable during the manufacturing process. The aim of this paper is to demonstrate that image processing tools enable fast and accurate void segmentation, while reducing manual interaction for X-ray monitoring of imperfect power transistor die soldering. The most common void parameters such as void area, void distribution, and shape roundness were extracted and used for statistical analysis. |
| Databáze: | OpenAIRE |
| Externí odkaz: |
|